The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Jun. 30, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Kai Liu, Phoenix, AZ (US);
Roy Chiu, Taichung, TW;
Nosun Park, San Diego, CA (US);
Je-Hsiung Lan, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Assignee:
QUALCOMM INCORPORATED, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01F 17/00 (2006.01); H01L 23/498 (2006.01); H10D 1/20 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01F 17/0013 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H10D 1/20 (2025.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01);
Abstract
A device comprising a die substrate, a plurality of interconnects located over the die substrate, wherein the plurality of interconnects are configured to operate as an inductor, at least one magnetic layer that surrounds at least part of the plurality of interconnects; and at least one dielectric layer that surrounds the at least one magnetic layer.