The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
May. 26, 2021
Applicant:
Baidu Usa Llc, Sunnyvale, CA (US);
Inventor:
Tianyi Gao, Sunnyvale, CA (US);
Assignee:
BAIDU USA LLC, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/38 (2006.01); H05K 7/20 (2006.01); H10N 10/01 (2023.01); H10N 10/13 (2023.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/38 (2013.01); H05K 7/20254 (2013.01); H10N 10/01 (2023.02); H10N 10/13 (2023.02);
Abstract
A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.