The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Nov. 04, 2021
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yeong-E Chen, Miao-Li County, TW;
Bi-Ly Lin, Miao-Li County, TW;
Kuang Chiang Huang, Miao-Li County, TW;
Yu Ting Liu, Miao-Li County, TW;
Assignee:
Innolux Corporation, Miaoli County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01); G02F 1/1339 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 22/12 (2013.01); H01L 24/03 (2013.01); G02F 1/1339 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/037 (2013.01); H01L 2224/117 (2013.01);
Abstract
The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.