The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Oct. 27, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Abbas Ali, Plano, TX (US);

Scott Hiemke, McKinney, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/74 (2006.01); H01L 21/762 (2006.01); H01L 23/58 (2006.01); H10D 1/00 (2025.01); H10D 1/66 (2025.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H01L 21/74 (2013.01); H01L 21/76224 (2013.01); H01L 23/585 (2013.01); H10D 1/692 (2025.01);
Abstract

A microelectronic device includes an integrated deep trench in a substrate, with a field oxide layer on the substrate. The integrated deep trench includes a of deep trench extending into semiconductor material of the substrate, a deep trench sidewall dielectric layer contacting the substrate and an electrically conductive trench-fill material contacting the deep trench sidewall dielectric layer. The conductive trench-fill material is covered during the formation of the field oxide layer to minimize the trench-fill seam void volume. Minimizing the trench-fill seam void volume minimizes optical defectivity observed in subsequent yield enhancement. The integrated deep trench may be configured as a capacitor or may be configured as a contact to the underlying substrate.


Find Patent Forward Citations

Loading…