The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

May. 12, 2021
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Hyun Tak Ko, Jeju-si, KR;

Sang Kee Lee, Cheonan-si, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32642 (2013.01); H01L 21/67103 (2013.01); H01L 21/6833 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01); H01L 21/67069 (2013.01);
Abstract

The present disclosure provides an electrostatic chuck, in which a heat transfer layer using a heat transfer fluid is disposed between a chuck main body disposed at an upper side of the electrostatic chuck and a chuck base disposed at a lower side of the electrostatic chuck, and the chuck main body is simply placed on the chuck base so as to be physically in contact with the heat transfer layer, such that heat may be stably transferred without damage even in a condition in which the heat transfer layer is at a high temperature, and the chuck main body may be easily separated from the chuck base for maintenance.


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Quick Actions:

Ko, Hyun. (2025). Electrostatic chuck, substrate processing apparatus, and substrate processing method (U.S. Patent No. 12354852). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12354852

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