The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jun. 16, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kwang Dong Seong, Suwon-si, KR;

Young Ah Song, Suwon-si, KR;

Bong Gyu Choi, Suwon-si, KR;

Do Kyeong Lee, Suwon-si, KR;

Jae Hoon Bang, Suwon-si, KR;

Wan Sik Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a conductive metal and glass, and wherein at least a portion of the glass includes a secondary phase of the glass including barium (Ba), aluminum (Al), and silicon (Si).


Find Patent Forward Citations

Seong, Kwang. (2025). Multilayer electronic component (U.S. Patent No. 12354808). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12354808

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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