The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Mar. 16, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kazuya Tobita, Tokyo, JP;

Youichi Kazuta, Tokyo, JP;

Yuichi Takubo, Tokyo, JP;

Junichiro Urabe, Tokyo, JP;

Noriaki Hamachi, Tokyo, JP;

Yuto Shiga, Tokyo, JP;

Toshinori Matsuura, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/0013 (2013.01); H01F 2017/002 (2013.01);
Abstract

A multilayer coil component includes: a through hole connecting portion electrically connecting an end portion of the coil portion and the external terminal, in which a coil pattern and a through hole pattern are formed in each of the plurality of layers, the through hole connecting portion is formed by mutually joining a plurality of the through hole patterns in the lamination direction, the through hole pattern in at least one first layer among the plurality of layers is shifted with respect to the through hole pattern in another second layer when viewed from the lamination direction, and, when viewed from the lamination direction, a distance between the through hole pattern in the first layer and a coil pattern in the first layer is farther than a distance between the through hole pattern in the second layer and the coil pattern in the first layer.


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