The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jul. 29, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seung Yoon Kim, Seoul, KR;

Kohji Kanamori, Seongnam-si, KR;

Jeehoon Han, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); H01L 23/528 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 41/40 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
G11C 16/0483 (2013.01); H01L 23/5283 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/40 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02);
Abstract

A three-dimensional semiconductor memory device includes: a stack structure including a ground selection line, first word lines, second word lines, and a string selection line, which are sequentially stacked on a substrate; vertical channel structures penetrating the stack structure and arranged to form a plurality of columns; a lower separation structure crossing a lower portion of the stack structure in a first direction and dividing the ground selection line along a second direction intersecting the first direction; and first and second upper separation structures crossing an upper portion of the stack structure in the first direction and dividing the string selection line along the second direction, wherein the lower separation structure and the first upper separation structure are vertically overlapped with one of the columns of the vertical channel structures, and the second upper separation structures are provided between the vertical channel structures.


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