The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jan. 11, 2023
Applicant:

Mars Semiconductor Corp., Hsinchu, TW;

Inventors:

Luen-Shen Yuan, Hsinchu, TW;

Yi-Shing Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/16 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 3/16 (2013.01); G06F 13/4068 (2013.01); G06F 13/4282 (2013.01); G06F 2213/0038 (2013.01);
Abstract

A system on chip (SOC) module has a first SOC for audio data transmission, and the first SOC has an audio data input/output (I/O) interface unit, a processing unit and a serial peripheral interface (SPI) unit. The audio data I/O interface unit is electrically connected to multiple audio input devices so as to receive multiple pieces of first audio data generated by the multiple audio input devices. The processing unit is used to store the multiple pieces of the first audio data. The SPI unit is electrically connected to a second SOC via a first SPI, so as to transmit the multiple pieces of the first audio data to the second SPI.


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