The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jun. 24, 2022
Applicant:

Aptiv Technologies Ag, Schaffhausen, CH;

Inventors:

Shrikant Bhadri, Bengaluru, IN;

Ravindra Kulkarni, Bengaluru, IN;

Kesav Kumar Sridharan, Bengaluru, IN;

Assignee:

Aptiv Technologies AG, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 9/00 (2006.01); B60R 16/023 (2006.01); G06F 1/18 (2006.01); G06F 30/10 (2020.01); G06F 113/24 (2020.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H05K 9/0041 (2013.01); B60R 16/0239 (2013.01); G06F 1/181 (2013.01); G06F 30/10 (2020.01); G06F 2113/24 (2020.01);
Abstract

Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner diameter and have a height along the axis relative to the plane, which provide greater stiffness to the planar portion compared to non-extruded holes. Techniques for producing enclosures with extruded holes such as this are also described. A schematic of an array of extruded holes can be generated by determining, based on a predetermined pilot hole diameter, a thickness of an associated portion of sheet metal, and a hole diameter, an extruded height usable for the extruded holes in the schematic. This may allow for simple conversion from an array of non-extruded thru holes to an array of extruded holes.


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