The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Oct. 21, 2021
Fujifilm Business Innovation Corp., Tokyo, JP;
Kiyohiro Yamanaka, Kanagawa, JP;
Satoshi Kamiwaki, Kanagawa, JP;
Takeshi Iwanaga, Kanagawa, JP;
Sumiaki Yamasaki, Kanagawa, JP;
Satoshi Inoue, Kanagawa, JP;
FUJIFILM Business Innovation Corp., Tokyo, JP;
Abstract
A method for producing pressure-responsive particles includes: adding an aggregating agent and a dispersion containing silica particles to a dispersion containing composite resin particles containing a styrene-based resin including a styrene compound and a vinyl monomer other than the styrene compound as polymer components and a (meth)acrylic acid ester-based resin including a (meth)acrylic acid ester compound as a polymer component to cause aggregation so as to form aggregated particles; and heating and fusing the aggregated particles to form pressure-responsive particles. The amount of the silica particles added by the dispersion containing the silica particles is 0.5 mass % or more and 10 mass % or less relative to a total mass of the composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the pressure-responsive particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature of resins contained in the pressure-responsive particles is 30° C. or more.