The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Feb. 13, 2023
Applicant:

Aurora Operations, Inc., Mountain View, CA (US);

Inventors:

James Ferrara, Oakland, CA (US);

Pruthvi Jujjavarapu, Palo Alto, CA (US);

Yongxuan Edward Liang, Fremont, CA (US);

Sen Lin, Mountain View, CA (US);

Zhizhong Tang, Palo Alto, CA (US);

Assignee:

AURORA OPERATIONS, INC., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); B60W 10/18 (2012.01); B60W 10/20 (2006.01); B60W 60/00 (2020.01); G01S 7/481 (2006.01); G01S 17/58 (2006.01); G01S 17/931 (2020.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
G01S 17/931 (2020.01); B60W 10/18 (2013.01); B60W 10/20 (2013.01); B60W 60/001 (2020.02); G01S 7/4817 (2013.01); G01S 17/58 (2013.01); H01L 23/481 (2013.01); H01L 25/167 (2013.01); B60W 2420/408 (2024.01); B60W 2554/4042 (2020.02); B60W 2554/802 (2020.02); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73257 (2013.01);
Abstract

A light detection and ranging (LIDAR) sensor system includes a circuit module. The circuit module includes a silicon substrate having a first thermal feature. The circuit module includes a III-V semiconductor substrate coupled to the silicon substrate, the III-V semiconductor substrate having a second thermal feature. The circuit board includes an optical device coupled to the III-V semiconductor substrate, the optical device configured to output a transmit beam. The circuit module further includes a plurality of vias disposed in a particular portion of the silicon substrate, where the particular portion corresponds to the III-V semiconductor substrate, at least one of the plurality of vias having a third thermal feature. The LIDAR system further includes a scanner configured to direct the transmit beam to an environment of the vehicle.


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