The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Oct. 27, 2022
Applicant:

Dong-a University Research Foundation for Industry-academy Cooperation, Busan, KR;

Inventors:

Hyo Jong Lee, Busan, KR;

Han Kyun Shin, Changwon-si, KR;

Sang Hyeok Kim, Busan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 5/10 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 21/12 (2013.01);
Abstract

The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wherein a concentration of impurities within the recrystallization suppressing layer is greater than a concentration of impurities within the recrystallization active layer.


Find Patent Forward Citations

Loading…