The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Oct. 27, 2022
Applicant:
Dong-a University Research Foundation for Industry-academy Cooperation, Busan, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 5/10 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 21/12 (2013.01);
Abstract
The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wherein a concentration of impurities within the recrystallization suppressing layer is greater than a concentration of impurities within the recrystallization active layer.
Quick Actions:
Lee, Hyo. (2025). Electrodeposition apparatus to prepare a multilayer copper foil (U.S. Patent No. 12351928). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12351928
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile