The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Feb. 07, 2020
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventors:
Toshihiro Hosoi, Ageo, JP;
Kenshiro Fukuda, Ageo, JP;
Yoshihiro Yoneda, Ageo, JP;
Tomohiro Ishino, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C08L 63/00 (2006.01); H01G 4/14 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C08L 63/00 (2013.01); H01G 4/14 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); B32B 2457/16 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2237 (2013.01); C08L 2203/20 (2013.01);
Abstract
There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.