The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Sep. 02, 2020
Taiyo Holdings Co., Ltd., Saitama, JP;
Yoko Shibasaki, Hiki-gun, JP;
Chihiro Funakoshi, Hiki-gun, JP;
TAIYO HOLDINGS CO., LTD., Hiki-gun, JP;
Abstract
Provided is a curable resin composition that has excellent heat resistance and low warpage and is, furthermore, capable of improving light transmittance in cured products, a dry film and its cured product of, and an electronic component containing the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator and (D) inorganic particles, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 1000; a dry film and its cured product; and an electronic component containing the cured product were obtained.