The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Dec. 21, 2018
Applicants:
Isabers Japan Co., Ltd., Tokyo, JP;
Tadatomo Suga, Nakano-ku, JP;
Inventors:
Tadatomo Suga, Nakano-ku, JP;
Yoshiie Matsumoto, Shinjuku, JP;
Assignees:
iSABers Japan Co., Ltd., Tokyo, JP;
Tadatomo SUGA, Nakano-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B32B 17/06 (2006.01); B32B 37/24 (2006.01); B32B 38/00 (2006.01); C03C 27/10 (2006.01); H01L 23/00 (2006.01); C03C 17/245 (2006.01); C23C 14/46 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C03C 27/10 (2013.01); B32B 17/06 (2013.01); B32B 37/24 (2013.01); B32B 38/0008 (2013.01); B32B 38/0036 (2013.01); H01L 24/83 (2013.01); B32B 2037/246 (2013.01); B32B 2255/20 (2013.01); B32B 2307/412 (2013.01); B32B 2309/02 (2013.01); B32B 2310/0875 (2013.01); B32B 2311/00 (2013.01); B32B 2315/08 (2013.01); C03C 17/245 (2013.01); C03C 2217/214 (2013.01); C03C 2218/152 (2013.01); C03C 2218/154 (2013.01); C03C 2218/32 (2013.01); C23C 14/46 (2013.01); C23C 16/45525 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83948 (2013.01);
Abstract
Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.