The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Dec. 28, 2020
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Makoto Moriya, Tokyo, JP;
Makoto Ishida, Tokyo, JP;
Shogo Otobe, Tokyo, JP;
Akihiro Terasaka, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
Provided is a composite material bonding apparatus that can reduce a cycle time when composite material members are bonded to each other. The composite material bonding apparatus includes a sheet-heater moving device that places a graphite heater at an insertion position between a first bonded surface of a first composite material member and a second bonded surface of a second composite material member such that the graphite heater is parallel to the first bonded surface and the second bonded surface facing the first bonded surface, and retracts the graphite heater to a retraction position from the insertion position. The first bonded surface and the second bonded surface are heated at the insertion position by the graphite heater, and then the graphite heater is moved to the retraction position by the sheet-heater moving device.