The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Mar. 28, 2022
Applicant:

Telefield Medical Imaging Limited, Hong Kong, HK;

Inventor:

Yongping Zheng, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 5/06 (2006.01); A61B 34/20 (2016.01);
U.S. Cl.
CPC ...
A61B 8/483 (2013.01); A61B 8/4254 (2013.01); A61B 8/4263 (2013.01); A61B 8/5215 (2013.01); A61B 8/5253 (2013.01); A61B 8/5269 (2013.01); A61B 5/06 (2013.01); A61B 5/061 (2013.01); A61B 5/065 (2013.01); A61B 34/20 (2016.02); A61B 2034/2055 (2016.02); A61B 2034/2057 (2016.02);
Abstract

Disclosed are a three-dimensional ultrasound imaging system and imaging method based on a three-dimensional tracking camera. The system includes: an ultrasound probe used for performing ultrasonic scanning on a region of interest of a target; a two-dimensional ultrasound imaging apparatus used for generating a two-dimensional ultrasound image of the region of interest on the basis of the ultrasound scanning; a three-dimensional spatial information acquisition apparatus, connected to the ultrasound probe and used for acquiring three-dimensional spatial information of the ultrasound probe; and a three-dimensional reconstruction module used for reconstructing a three-dimensional ultrasound image on the basis of the three-dimensional spatial information of the ultrasound probe and the two-dimensional ultrasound image. A three-dimensional ultrasound image can be reconstructed in a flexible, low-cost and small-dimension manner, and interference can be effectively avoided.


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