The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Nov. 22, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Keisuke Teranishi, Tokyo, JP;

Hiroki Mitsui, Tokyo, JP;

Miho Kato, Tokyo, JP;

Hideya Sakamoto, Tokyo, JP;

Narumi Sato, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H10N 30/20 (2023.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01);
U.S. Cl.
CPC ...
H10N 30/875 (2023.02); H10N 30/204 (2023.02); H10N 30/88 (2023.02);
Abstract

The vibration device includes a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element, a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal, a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element, and a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member. The second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer.


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