The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Mar. 12, 2021
Applicant:
Vuereal Inc., Waterloo, CA;
Inventors:
Gholamreza Chaji, Waterloo, CA;
Ehsanollah Fathi, Waterloo, CA;
Assignee:
VueReal Inc., Waterloo, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H10H 20/832 (2025.01); H10H 29/14 (2025.01); H01L 21/48 (2006.01); H10H 20/01 (2025.01); H10H 20/855 (2025.01);
U.S. Cl.
CPC ...
H10H 29/142 (2025.01); H01L 21/6835 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/24 (2013.01); H01L 24/92 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H10H 20/835 (2025.01); H01L 21/486 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32235 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80385 (2013.01); H01L 2224/80907 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H10H 20/032 (2025.01); H10H 20/0363 (2025.01); H10H 20/855 (2025.01);
Abstract
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.