The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jun. 02, 2021
Shenzhen Raysees Ai Technology Co., Ltd., Shenzhen, CN;
Abstract
The present application relates to the technical field of optical integrated devices, and specifically discloses a semiconductor light source device of optical integrated packaging with high light extraction efficiency and low device heat generation. The semiconductor light source device of optical integrated packaging comprises a substrate, an optical lens, a LED chip and a light transmitting glue layer, the substrate is provided with a circuit, and the optical lens is fixedly connected with the substrate; a light source cavity is provided between the optical lens and the substrate; the LED chip and the light transmitting glue layer are respectively accommodated in the light source cavity; the LED chip is arranged on top of the circuit and electrically connected with the circuit; the light transmitting glue layer is at least arranged on an upper surface of the LED chip; the light transmitting glue layer is used to reduce Fresnel loss when the light of the LED chip is taken out; an outer surface of the light transmitting glue layer is a convex surface, and the convex surface is used to reduce a total reflection loss of a light emitted by the LED chip.