Sensor package and method of manufacturing the same

Abstract

A sensor package includes: an image sensor including a body layer having an upper surface and a lower surface, opposite to the upper surface, a pixel layer disposed on the upper surface, a microlens array disposed on the pixel layer, a connection terminal disposed on the lower surface, and a through-via extending between the upper surface and the lower surface and electrically connected to the connection terminal; a support structure disposed on the pixel layer and having an opening in which the microlens array is accommodated; an optical filter disposed on the support structure and having a first region, overlapping the image sensor in a first direction, and a second region extending from the first region in a second direction, perpendicular to the first direction, and not overlapping the image sensor in the first direction; an encapsulant surrounding a side surface of the image sensor and a side surface of the support structure and covering and contacting a portion of a lower surface of the second region; and a connection bump disposed on the connection terminal of the image sensor. In the second direction, a first distance along a boundary where the lower surface of the optical filter at the second region contacts the encapsulant is greater than a second distance of a lower surface of the optical filter at the second region exposed from the encapsulant.