The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Nov. 01, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Hiroyuki Hattori, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/18 (2025.01); G01S 7/481 (2006.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01); G01S 17/08 (2006.01);
U.S. Cl.
CPC ...
H10F 39/182 (2025.01); G01S 7/4816 (2013.01); H10F 39/024 (2025.01); H10F 39/12 (2025.01); H10F 39/184 (2025.01); H10F 39/199 (2025.01); H10F 39/8053 (2025.01); H10F 39/8057 (2025.01); H10F 39/8063 (2025.01); H10F 39/807 (2025.01); H10F 39/811 (2025.01); G01S 17/08 (2013.01); H10F 39/011 (2025.01);
Abstract

A solid-state imaging device is provided with a substrate in which a plurality of photoelectric conversion parts is formed, and with a light incident surface layer formed on the light incident surface of the substrate. The substrate and the light incident surface layer include a compound semiconductor containing germanium. A concentration of the germanium in the light incident surface layer increases toward a surface side remote from the substrate. At the time of production, isotropic etching is performed after a lattice-shaped groove is formed in the light incident surface layer, so that a groove width of the lattice-shaped groove increases toward a light incident surface side of the light incident surface layer due to a difference in etching rate attributed to the concentration of the germanium, and an uneven structure having a tapered bump can thus be formed relatively easily.


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