The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

May. 19, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Muxin Di, Beijing, CN;

Zhiwei Liang, Beijing, CN;

Yingwei Liu, Beijing, CN;

Ke Wang, Beijing, CN;

Zhanfeng Cao, Beijing, CN;

Guangcai Yuan, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H10D 30/67 (2025.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); H01L 23/4985 (2013.01); H01L 25/0753 (2013.01); H10D 30/6723 (2025.01); H10D 86/0214 (2025.01); H10D 86/411 (2025.01); H10D 86/441 (2025.01); H10H 20/857 (2025.01); H10H 20/0364 (2025.01);
Abstract

A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.


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