The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Aug. 01, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Keitaro Ito, Kariya, JP;

Teruhisa Akashi, Kariya, JP;

Hideki Terasawa, Kariya, JP;

Suguru Houchi, Kariya, JP;

Naoki Yoshida, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.


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