The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jan. 13, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Bumhee Bae, Suwon-si, KR;
Younghun Seong, Suwon-si, KR;
Jaehoon Lee, Suwon-si, KR;
Jeongnam Cheon, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 3/08 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/26 (2006.01); B32B 27/36 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 9/00 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0272 (2013.01); H05K 1/181 (2013.01); G06F 1/1652 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01);
Abstract
A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.