Method and apparatus for integrating spark gaps into semiconductor packaging

Abstract

The present invention is a spark gap capable of integrating into multiple layer semiconductor substrate packaging. The initial gap in the spark gap is solid and it can be converted into air, meaning gaseous, and the air gap is achieved by having the gap initially be filled with a solid and then running a voltage through the spark gap so that the gap explodes and the solid is replaced by an air cavity. The spark gap may be formed by initially electroplating electrodes through a dry film-based process, and then, to further close the gap between electrodes, beyond the practical limits of dry film, pigtail plating may be used. This pigtail plating may expand the electrodes and thus reduce the gap distance.