The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jul. 31, 2023
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, KR;

Inventors:

Soodeok Moon, Yongin-si, KR;

Younghwan Kwon, Yongin-si, KR;

Chuljung Yun, Yongin-si, KR;

Kyungho Cho, Yongin-si, KR;

Assignee:

Samsung SDI Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/42 (2006.01); H01M 10/48 (2006.01); H01M 50/209 (2021.01); H01M 50/264 (2021.01); H01M 50/298 (2021.01); H01M 50/30 (2021.01); H01M 50/516 (2021.01);
U.S. Cl.
CPC ...
H01M 10/425 (2013.01); H01M 10/48 (2013.01); H01M 50/209 (2021.01); H01M 50/298 (2021.01); H01M 50/30 (2021.01); H01M 50/516 (2021.01); H01M 50/264 (2021.01);
Abstract

This application relates to a battery pack including a battery cell, a circuit board configured to collect state information about the battery cell, and a connection line configured to transmit the state information about the battery cell to the circuit board and including a link line and a board connection pad. The link line extends from a side of the battery cell toward the circuit board, and the board connection pad extends from a first end portion, to which the link line is connected, and is coupled to the circuit board while facing the circuit board. The board connection pad includes outer soldering portions formed in an outer region of the board connection pad and concave toward the outside of the board connection pad and a gas discharge hole formed in a closed loop shape in an inner region of the board connection pad.


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