The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Oct. 19, 2023
Applicant:
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Inventors:
Chee Hiong Chew, Seremban, MY;
Erik Nino Tolentino, Seremban, MY;
Vemmond Jeng Hung Ng, Senawang, MY;
Shutesh Krishnan, Seremban, MY;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/3735 (2013.01); H01L 24/40 (2013.01); H01L 24/84 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/4001 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/4052 (2013.01); H01L 2224/40991 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/84931 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01);
Abstract
Implementations of semiconductor packages may include one or more die coupled over a substrate, an electrically conductive spacer coupled over the substrate, and a clip coupled over and to the one or more die and the electrically conductive spacer. The clip may electrically couple the one or more die and the electrically conductive spacer.