The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
May. 19, 2020
Applicant:
Pragmatic Semiconductor Limited, Cambridge, GB;
Inventors:
Ken Williamson, Sedgefield, GB;
Richard Price, Sedgefield, GB;
Assignee:
PRAGMATIC SEMICONDUCTOR LIMITED, Cambridge, GB;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/5225 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16268 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A method for fabricating a thin-film integrated circuit, IC, including a plurality of electronic components, the method comprising: forming, using a first fabrication technique, the plurality of electronic components, and forming, using a second fabrication technique, a conductive layer on the plurality of electronic components to form a redistribution layer, RDL, wherein the first fabrication technique includes photolithographic patterning, and the first fabrication technique is different to the second fabrication technique.