The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Apr. 19, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bonggyu Kang, Yongin-si, KR;
Yongha Kim, Seongnam-si, KR;
Youngsoo Jang, Suwon-si, KR;
Heesu Kim, Suwon-si, KR;
Kwangsoo Park, Suwon-si, KR;
Junsik Park, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.