The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Aug. 19, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Janggeun Lee, Delmar, NY (US);

Jaemyung Choi, Niskayuna, NY (US);

Wonhyuk Hong, Clifton Park, NY (US);

Kang-ill Seo, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76819 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01);
Abstract

Integrated circuit devices are provided. An integrated circuit device includes a first insulating layer and a metal via that is in the first insulating layer. The integrated circuit device includes a second insulating layer on the first insulating layer. The integrated circuit device includes a conductive material that is between sidewalls of the second insulating layer and on the metal via. Moreover, the integrated circuit device includes a metal line that is on the conductive material and/or the second insulating layer. Related methods of forming integrated circuit devices are also provided.


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