The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jul. 09, 2021
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Reginald D. Bean, Center Point, IA (US);
Rockwell Collin Inc., Cedar Rapids, IA (US);
Abstract
An electronic assembly is disclosed. The electronic assembly includes a first attachment layer, a second attachment layer, a first interposer redistribution layer, a second interposer redistribution layer, at least one of a thermal spreader layer or a thermal management layer, and an interposer cavity. The interposer further includes an interconnect header fixed within the interposer cavity comprising a plurality of interconnect filaments configured to electrically couple to at least one of the first interposer redistribution layer or the second interposer redistribution layer. The interconnect header is generated by applying electrically conductive filaments on a plurality of wafers, thinning the wafers, stacking the wafers, attaching the wafers into a wafer stack, and dicing the wafer stack.