The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Mar. 20, 2023
Applicant:

Auras Technology Co., Ltd., New Taipei, TW;

Inventors:

Cheng-Ju Chang, New Taipei, TW;

Wan-Hsuan Lin, New Taipei, TW;

Chung-Chien Su, New Taipei, TW;

Assignee:

AURAS TECHNOLOGY CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); F28F 1/12 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F28F 1/12 (2013.01); H01L 23/4006 (2013.01); H05K 7/20336 (2013.01); H05K 7/20509 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.


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