The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Jan. 08, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Nobuyoshi Kimoto, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01);
Abstract
It is an object to provide technology enabling suppression of contact deformation of pin fins during assembly of a semiconductor device and the like. A semiconductor device includes a base plate, a semiconductor element, and a resin member. The base plate has a plurality of pin fins on a lower surface thereof. The semiconductor element is mounted on an upper side of the base plate. The resin member covers at least a side surface of the semiconductor element. The resin member has a rib covering a side surface of the base plate, and a lower end of the rib is located below lower ends of the plurality of pin fins.