The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

May. 10, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Lance A. Scudder, Sunnyvale, CA (US);

Sukti Chatterjee, San Jose, CA (US);

David Masayuki Ishikawa, Mountain View, CA (US);

Yuriy V. Melnik, San Jose, CA (US);

Vibhas Singh, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/02 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/54 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32449 (2013.01); C23C 16/0272 (2013.01); C23C 16/345 (2013.01); C23C 16/40 (2013.01); C23C 16/403 (2013.01); C23C 16/4408 (2013.01); C23C 16/45536 (2013.01); C23C 16/4554 (2013.01); C23C 16/45553 (2013.01); C23C 16/45555 (2013.01); C23C 16/50 (2013.01); C23C 16/54 (2013.01); H01J 37/32743 (2013.01); H01J 37/32752 (2013.01); H01J 2237/20278 (2013.01); H01J 2237/332 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.


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