The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Mar. 23, 2022
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Shih-Hsin Hsu, Taipei, TW;

Jau-Jan Deng, Taipei, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); G02B 1/11 (2015.01); G02B 3/00 (2006.01); G02B 5/20 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01); G02B 1/11 (2013.01); G02B 3/0075 (2013.01); G02B 5/208 (2013.01);
Abstract

An under-display optical fingerprint sensors employing microlens arrays (MLAs) and an opaque aperture layer includes high aspect-ratio metal aperture structures for efficient angular signal filtering and stray light control. Instead of relying on one or more opaque aperture baffle-layers, embodiments disclosed herein utilize an image sensor's inherent metal layers for filtering signals originated from unwanted angular ranges and blocking undesired stray light could achieve similar or better performance with simplified process flow and lower cost. Layers from the sensors' inherent metal layers are brought into the sensing area on purpose to form the high aspect-ratio metal aperture structure. The metal layers in the sensing area may include apertures aligned to apertures in the opaque layer, and may also be grounded.


Find Patent Forward Citations

Loading…