The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Dec. 12, 2022
Applicant:

Alibaba (China) Co., Ltd., Zhejiang Province, CN;

Inventors:

Shuangchen Li, Sunnyvale, CA (US);

Zhe Zhang, Shanghai, CN;

Dimin Niu, San Mateo, CA (US);

Hongzhong Zheng, Los Gatos, CA (US);

Assignee:

ALIBABA (CHINA) CO., LTD., Zhejiang Province, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/78 (2006.01); G06F 12/0813 (2016.01); G06F 15/173 (2006.01); G06F 15/80 (2006.01);
U.S. Cl.
CPC ...
G06F 15/17381 (2013.01); G06F 12/0813 (2013.01); G06F 15/7807 (2013.01); G06F 15/7825 (2013.01); G06F 15/8023 (2013.01);
Abstract

The present disclosure discloses a processor. The processor is used to perform parallel computation and includes a logic die and a memory die. The logic die includes a plurality of processor cores and a plurality of networks on chip, wherein each processor core is programmable. The plurality of networks on chip are correspondingly connected to the plurality of processor cores, so that the plurality of processor cores form a two-dimensional mesh network. The memory die and the processor core are stacked vertically, wherein the memory die includes a plurality of memory tiles, and when the processor performs the parallel computation, the plurality of memory tiles do not have cache coherency; wherein, the plurality of memory tiles correspond to the plurality of processor cores in a one-to-one or one-to-many manner.


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