The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Apr. 26, 2022
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chin-Jou Kuo, Tainan, TW;

Bor-Shiun Lee, New Taipei, TW;

Ming-Fa Chen, Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/08 (2022.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01J 5/02 (2022.01); G01J 5/20 (2006.01);
U.S. Cl.
CPC ...
G01J 5/0815 (2013.01); B81B 3/0021 (2013.01); B81C 1/00476 (2013.01); G01J 5/0205 (2013.01); G01J 5/0225 (2013.01); G01J 5/20 (2013.01); B81B 2201/0278 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0105 (2013.01); B81C 2201/0125 (2013.01);
Abstract

A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.


Find Patent Forward Citations

Loading…