The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jul. 23, 2024
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Yuki Machida, Tokyo, JP;

Shuta Hikichi, Tokyo, JP;

Hirofumi Aoki, Tokyo, JP;

Kenya Kawabata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28F 3/04 (2006.01);
U.S. Cl.
CPC ...
F28F 3/042 (2013.01); F28F 2255/00 (2013.01);
Abstract

Provided is a cold plate that can improve cooling efficiency and simultaneously suppress an increase in size in the thickness direction. A heat-transfer-medium flow spaceis formed between a heat dissipation surface of a base plate and a cover plate, the base plate has a plurality of heat transfer portionsthat are provided so as protrude from the heat dissipation surface toward the cover plateand that transfer, to a heat-transfer medium flowing through the heat-transfer-medium flow space, heat released from the heat dissipation surface, and concave portions, into which at least a portion of tips of the plurality of heat transfer portionsare inserted, are formed in a surface of the cover plate facing the heat-transfer-medium flow space.


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