The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jan. 18, 2024
Applicant:

Nippon Filcon Co., Ltd., Tokyo, JP;

Inventor:

Ikuo Ueda, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D03D 11/00 (2006.01); D03D 1/00 (2006.01); D03D 13/00 (2006.01); D21F 7/08 (2006.01);
U.S. Cl.
CPC ...
D03D 13/006 (2013.01); D03D 1/00 (2013.01); D10B 2505/00 (2013.01);
Abstract

Each of upper surface side warps arranged vertically with lower surface side warps in pairs has a common weaving pattern excluding binding wefts. Binding warps constitute at least one of two warps vertically arranged forming pairs. In the pairs formed by the binding warps and the warps arranged vertically with the binding warps, the warps complement each other to form a weaving pattern for one upper surface side warp and a weaving pattern for one lower surface side warp, respectively, The upper surface side warps and the binding warps are interwoven with the upper surface side wefts to form an upper surface side fabric formed in a predetermined weaving pattern for each warp row. The lower surface side warps and the binding warps are interwoven with the lower surface side wefts to form a lower surface side fabric formed in a predetermined weaving pattern for each warp row.


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