The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Dec. 01, 2020
Applicant:
Adeka Corporation, Tokyo, JP;
Inventors:
Akihiro Nishida, Tokyo, JP;
Atsushi Yamashita, Tokyo, JP;
Assignee:
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/18 (2006.01); C07F 1/08 (2006.01); C09D 1/00 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/18 (2013.01); C07F 1/08 (2013.01); C09D 1/00 (2013.01); C23C 16/45536 (2013.01); C23C 16/45553 (2013.01);
Abstract
Provided is a method of producing a copper-containing layer, including: step 1: a step of reducing a surface of a substrate, provided that a substrate having a surface formed of a silicic acid compound is excluded, through use of a reducing agent; and step 2: a step of forming a copper-containing layer on the surface having been reduced in the step 1 through use of a thin-film forming raw material containing a copper compound by a plasma atomic layer deposition method.