The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jun. 02, 2020
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Tomomichi Kanda, Ichihara, JP;

Takamichi Aoki, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 81/02 (2006.01); B29C 48/00 (2019.01); B29C 48/40 (2019.01); B32B 15/08 (2006.01); B32B 15/088 (2006.01); B32B 15/20 (2006.01); B32B 27/16 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); C08G 75/0204 (2016.01); C08G 75/0209 (2016.01); C08J 3/20 (2006.01); C08J 5/04 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 7/14 (2006.01); C08L 77/00 (2006.01); C08L 77/06 (2006.01); C08L 77/10 (2006.01);
U.S. Cl.
CPC ...
C08L 81/02 (2013.01); B29C 48/022 (2019.02); B29C 48/40 (2019.02); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/20 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/34 (2013.01); C08G 75/0204 (2013.01); C08G 75/0209 (2013.01); C08J 3/203 (2013.01); C08J 5/043 (2013.01); C08K 3/22 (2013.01); C08K 3/346 (2013.01); C08K 7/14 (2013.01); C08L 77/00 (2013.01); C08L 77/06 (2013.01); C08L 77/10 (2013.01); B29C 2948/92704 (2019.02); B32B 2250/02 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/302 (2020.08); B32B 2264/303 (2020.08); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); B32B 2605/00 (2013.01); C08J 2369/00 (2013.01); C08J 2371/12 (2013.01); C08J 2377/00 (2013.01); C08J 2481/04 (2013.01); C08K 2003/2248 (2013.01); C08K 2003/2251 (2013.01); C08L 2201/08 (2013.01); C08L 2203/30 (2013.01); C08L 2205/22 (2013.01);
Abstract

The present invention is a molded article containing a polyarylene sulfide resin, a thermoplastic resin other than the polyarylene sulfide resin, and a metal oxide containing at least one of copper or chromium. The polyarylene sulfide resin forms a continuous phase, and a dispersed phase containing the thermoplastic resin and the metal oxide is present in the continuous phase. The present invention is also a polyarylene sulfide resin composition for providing it, a molded article having a roughened surface, a laminate of the molded article and metal, and methods for producing them. According to the present invention, there is provided a molded article that has superior heat resistance of a polyarylene sulfide resin, on which the speed of plating deposition is practical, and with which a laminate with potentially maintained adhesiveness of plating can be obtained and a method for producing it, as well as a polyarylene sulfide resin composition.


Find Patent Forward Citations

Kanda, Tomomichi. (2025). Polyarylene sulfide resin composition, molded article obtained by molding same, laminate, and production method thereof (U.S. Patent No. 12344744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12344744

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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