The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Dec. 22, 2022
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Noriyuki Nakai, Tokyo, JP;
Takamitsu Hoshihira, Kanagawa, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 3/26 (2006.01); B32B 37/12 (2006.01); B81B 1/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 3/263 (2013.01); B32B 37/12 (2013.01); B81B 1/002 (2013.01); B81B 2201/052 (2013.01); B81C 3/001 (2013.01); B81C 2203/032 (2013.01);
Abstract
A device includes a first member, a second member, and a bonding layer. A first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer. The bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive. A distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer.