The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Sep. 17, 2020
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Takeshi Murashige, Osaka, JP;
Junichi Inagaki, Osaka, JP;
Keisuke Sato, Osaka, JP;
Atsushi Kishi, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 1/08 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10761 (2013.01); B32B 1/08 (2013.01); B32B 7/12 (2013.01); B32B 17/10009 (2013.01); B32B 17/1055 (2013.01); B32B 2250/05 (2013.01); B32B 2250/42 (2013.01); B32B 2307/732 (2013.01);
Abstract
A multi-layer structure includes a glass layer having a thickness of greater than or equal to 10 μm and less than or equal to 200 μm; and a resin layer. A number of unit lamination structures in a thickness direction of the multi-layer structure is greater than or equal to 5 and less than or equal to 20,000, the unit lamination structure being a lamination structure composed of the glass layer and the resin layer.