The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Sep. 07, 2018
Applicant:

University Public Corporation Osaka, Osaka, JP;

Inventors:

Masakazu Shibahara, Osaka, JP;

Kazuki Ikushima, Osaka, JP;

Atsushi Kawahara, Osaka, JP;

Rino Takeuchi, Osaka, JP;

Hikaru Hashizume, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 15/00 (2006.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); G06F 30/23 (2020.01); G06F 113/10 (2020.01); G06F 119/14 (2020.01);
U.S. Cl.
CPC ...
B23K 31/003 (2013.01); B23K 15/0086 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G06F 30/23 (2020.01); G06F 2113/10 (2020.01); G06F 2119/14 (2020.01);
Abstract

A displacement/stress computation unit computes residual stress and deformation by conducting a thermal-elastic-plastic analysis using idealized explicit FEM. A temperature increment is set in magnitude to have a value larger in magnitude than a temperature increment used in a thermal-elastic-plastic analysis using static implicit FEM. Heating is performed for each plurality of blocks according to a heating pattern in which blocks that are not adjacent to one another are simultaneously heated. Each block is heated with a surface heat source having a heat input quantity adjusted with respect to a heat input quantity applied when a moving heat source is used to heat the block.


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