Anisotropic conductive electrical connection from a conductive pathway through a ceramic casing to a circuit board electronic component housed inside the casing

Abstract

An AIMD includes a ceramic base closed with a ceramic lid, both cooperatively separating body fluid and device sides. The lid and circuit board both have active and conductive pathways. A circuit board has active and ground conductive pathways. An anisotropic conductive layer disposed between the lid device side and the circuit board has a first thickness where a first conductive particle is in electrical contact with the lid and the circuit board active conductive pathways electrically connected to the active terminal of an electronic component on the circuit board, a second thickness where a second conductive particle is in electrical contact with the lid and the circuit board ground conductive pathways electrically connected to the ground terminal of the electronic component. The anisotropic conductive layer has a third, greater thickness where no conductive particles are in electrical contact with the lid and circuit board conductive active and ground pathways.