The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Jan. 06, 2023
Applicant:

Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;

Inventors:

Chien-Lung Wu, Hsinchu, TW;

Yu-Han Kao, New Taipei, TW;

Ching-Chun Chou, Hsinchu, TW;

Yi-Shu Ou, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/014 (2025.01); H10F 39/18 (2025.01); H10F 39/807 (2025.01);
Abstract

A manufacturing method of an image sensor structure including the following steps is provided. A substrate structure is provided. A first patterned hard mask layer is formed on the substrate structure. The first patterned hard mask layer has a first opening. A first ion implantation process is performed on the substrate structure by using the first patterned hard mask layer as a mask to form a first isolation region in the substrate structure. A first hard mask layer is formed on the first patterned hard mask layer. The first hard mask layer is formed in the first opening to form a first recess. The width of the first recess is smaller than the width of the first opening. A second ion implantation process is performed on the substrate structure by using the first hard mask layer as a mask to form a doped region in the substrate structure.


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