The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Jan. 23, 2023
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Thomas Scott Morris, Lewisville, NC (US);

Howard Terry Glascock, Oak Ridge, NC (US);

Charles E. Carpenter, Orlando, FL (US);

Mudar Al-Joumayly, Casselberry, FL (US);

Peter Cotterill, Cary, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01F 27/36 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01F 27/02 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H03H 9/54 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01F 27/363 (2020.08); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/552 (2013.01); H01F 27/022 (2013.01); H01L 23/295 (2013.01); H01L 23/3736 (2013.01); H01L 23/49833 (2013.01); H03H 9/54 (2013.01);
Abstract

The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.


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