The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Apr. 14, 2023
Applicant:

Toppan Inc., Tokyo, JP;

Inventors:

Takeshi Tamura, Tokyo, JP;

Tetsuyuki Tsuchida, Tokyo, JP;

Assignee:

TOPPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/46 (2013.01); H05K 1/02 (2013.01); H05K 2201/0769 (2013.01); H05K 2203/1338 (2013.01);
Abstract

A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.


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